Mechanical Engineer

As a Mechanical Engineer, you will own the physical architecture and end-to-end development lifecycle of high-density Ethernet switches. You will be solving the thermodynamic and structural challenges of 1000W+ ASICs and ultra-high-speed optics, driving products from initial concept through global manufacturing ramp-up and addressing issues from deployed units in the field.

Responsibilities

• Define the mechanical enclosure and internal layout for high-density 1U/2U/4U rack-mount switches, balancing airflow, cable management, manufacturability, and serviceability.
• Design and simulate cooling solutions (heatsinks, cold plates, fan trays) for 500W–1000W+ ASICs and high-speed optics (QSFP-DD/OSFP)
• Perform 3D tolerance stacks to ensure perfect alignment of high-speed connectors and prevent signal integrity loss.
• Specify materials for structural rigidity, thermal conductivity, and EMI shielding.
• Develop and execute DOEs and utilize SPC to analyze manufacturing data for driving informed decisions with global factory teams.
• Lead the setup and optimization of final manufacturing lines, including the definition of SOPs for work center assembly steps.
• Critique and approve assembly fixtures, drive high-yield assembly through rigorous DFx reviews and optimizations with local and overseas CMs/JDMs.
• Lead mechanical validation processes for shock, vibration, thermal cycling, and acoustic compliance (NEBS/ETSI/ISO).
• Manage the ECO process, ensuring seamless communication of design changes between engineering, operations, and CM partners.

Qualifications

• BS/MS in Mechanical Engineering and 8+ years in electronics packaging (Datacenter/Networking preferred).
• Expert proficiency with CAD tools (SolidWorks, Creo, NX, or equivalent)
• Proficiency with FEA and CFD tools (Ansys Mechanical, Ansys Icepak, FloTHERM, or equivalent)
• Understanding of manufacturing processes and tradeoffs (sheet metal bending, CNC machining, die-casting, plastic injection modeling, etc).
• Experience working with Contract Manufacturers and mass production DFM/DFA.
• Track record of taking complex products from concept through mass production and sustaining.
• Experience with High-Power platforms (ASICs, GPUs, or CPUs) in constrained environments is a significant plus
• Familiarity with OCP standards and liquid cooling (cold plates/immersion) is a significant plus.